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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Expertise in thermal technology development and testing for electronic devices, with a strong focus on liquid cooling solutions and thermal interface materials. Proven ability to lead cross-functional collaborations and drive innovation in thermal design and analysis.
Highest-signal resume keywords
Thermal Technology Roadmap DevelopmentLiquid Cooling Solutions DesignThermal Interface Material TestingComputational Fluid Dynamics SimulationMicroelectronics Packaging Design
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Thermal Performance AnalysisMechanical Design ValidationThermal Conductivity TestingThermal Testing Standards (JEDEC JESD 51)Cooling Solution Development
Soft Skills
CollaborationLeadershipCommunication
Tools & Technologies
Computational Fluid Dynamics ToolsThermal Interface MaterialsCooling Technologies (Pumps, Heat Pipes, Vapor Chambers)Electronic Assembly Testing
Industry Keywords
MicroelectronicsThermal EngineeringLiquid Cooling ManufacturingPackaging TechnologiesReliability Analysis
About the role
Key responsibilities & impact- Develop and lead system thermal technology roadmap in partnership with microelectronics packaging suppliers, thermal interface material suppliers, cooling solution providers and internal partners to meet Cisco products’ needs.
- Develop quality strategy for liquid cooling manufacturing process.
- Investigate innovative liquid cooling solutions for hardware systems in large scale.
- Derive the tradeoffs in thermal performance of different package design elements (substrate, underfill, thermal interface material, heat spreader etc.) and chip thermal gradients from experimental test data.
- Develop test plans and qualification requirements to ensure mechanical and manufacturing adaptability of thermal cooling solutions (pumps, heat pipes, vapor chambers, heat sinks, liquid cooling etc.).
- Engage with external vendors including ODM and component vendors on design, test and production.
- Develop and publish case studies/technical papers describing thermal analysis of cooling systems.
- Establish the parameters for thermal design/testing, correlation of design/test results to model predictions.
- Contribute to analytical and numerical models using various Computational Fluid Dynamics tools to simulate and analyze different device level cooling schemes.
- Drive supplier ecosystem development, and participate in industry consortia, conferences and collaborate with academia and other strategic partners to develop new methodologies and influence Cisco’s position in the industry.
- Integrate Circuit Thermal simulation and testing and system level cooling technologies.
- Mechanical design validation and testing for electronic assemblies
- Coordinate Circuit Packaging technologies (BGA, large body size Flip Chip BGA, 2.5D and 3D Packaging)
- Component and system reliability analysis
Requirements
What you’ll need- BS in Mechanical/Thermal or Chemical Engineering
- 10+ years’ experience in design, simulation, and testing of thermal solutions for electronic devices and systems
- Familiar with manufacturing process for key liquid cooling components
- Experience with advanced air-cooling technologies (vapor chamber and remote heat sinks, thermal interface materials, fans/fan trays)
- Preferred: MS or PhD in Mechanical or Chemical Engineering or related field
- 15+ years of relevant proven experience in microelectronics thermal cooling
- Experience with JEDEC JESD 51 thermal testing standards
- Experience with Thermal Interface Material Thermal Conductivity Testing procedures and microelectronics packaging design and manufacturing process
Benefits
Comp & perks- Health insurance
- 10 days off each year for community service
- Professional development opportunities
- Flexible work arrangements