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Core Competencies
Role fitCore Competencies
Use this summary to align your resume positioning with the role.
Demonstrates expertise in package layout design, including high-speed signal design and power distribution networks, while effectively leading and managing global engineering teams. Proficient in utilizing EDA tools and driving design methodology improvements to ensure project success.
Highest-signal resume keywords
Package Layout DesignHigh-Speed Signal DesignPower Distribution NetworksCadence APD+Team Leadership
ATS Keywords
Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills
Package LayoutIC Package Design PrinciplesPinout OptimizationHigh-Speed RoutingScripting in PythonScripting in PerlScripting in TCLDesign Methodology ImprovementsVendor ManagementRemote Team Management
Soft Skills
Excellent Communication SkillsTeam DevelopmentCollaboration
Tools & Technologies
EDA ToolsCadence APD+
Industry Keywords
Electrical EngineeringSilicon Floor PlanningSignal IntegrityPower IntegrityASIC Package Layout
Tech Stack
Tools & technologiesPerlPython
About the role
Key responsibilities & impact- Lead and grow a global package layout team spanning different regions, including direct management of regional team leaders.
- Define and drive the technical strategy and roadmap for package layout, ensuring alignment with Cisco Silicon One's product goals.
- Own package design planning and scheduling from concept through implementation, ensuring on-time delivery across distributed teams.
- Guide the optimization of package pinouts, stack-ups, power distribution, and high-speed routing, fostering collaboration with silicon floor planning, signal integrity, and power integrity teams globally.
- Partner with vendors, drive innovation, and establish best practices that elevate the quality and efficiency of the projects.
- Recruit, develop, and retain top layout engineering talent across regions, creating a high-performing, cohesive, and inclusive global team.
Requirements
What you’ll need- Bachelor's or Master's degree in Electrical Engineering or a related field
- At least 7 years of experience in Package Layout
- Strong understanding of high-speed signal design, power distribution networks (PDN), and IC package design principles
- Experience with industry-standard EDA tools for package layout and design
- Excellent verbal and written English communication skills
- Experience managing remote or globally distributed engineering teams (Preferred)
- Proficiency in Cadence APD+ or equivalent IC package EDA tools (Preferred)
- Experience in ASIC package layout design, including pinout optimization and high-speed routing (Preferred)
- Knowledge of silicon floor planning, SI, and PI considerations at the package level (Preferred)
- Track record of driving design methodology improvements and delivering results through others (Preferred)
- Experience working with global vendors and managing outsourced layout activities (Preferred)
- Scripting experience in Python, Perl, or TCL (Preferred).
Benefits
Comp & perks- Health insurance
- Professional development
- Flexible work arrangements
