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Cisco

ASIC Engineer

Cisco

Technical expert in advanced semiconductor packaging technologies for Cisco. Leading and resolving technical challenges in assembly solutions with cross-functional collaboration and innovative approaches.

Posted 7/4/2026full-timeTaipei • 🇹🇼 TaiwanMid-LevelSeniorWebsite

Core Competencies

Role fit
Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in advanced packaging technologies and assembly processes, with a strong focus on DfM/DfR principles and comprehensive knowledge of CoWoS package assembly. Proven ability to develop and execute innovative solutions in the Semiconductor Packaging and Assembly Industry.

Highest-signal resume keywords
Advanced Packaging Technology DevelopmentCoWoS Package AssemblyDfM/DfR PrinciplesSubstrate Manufacturing ProcessesMechanical Engineering

ATS Keywords

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Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills
Advanced Packaging TechnologiesAssembly Process IntegrationReliability PlanningDesign for ManufacturingDesign for ReliabilityPhysical Attribute DesignMaterial SelectionHeterogeneous IntegrationProcess DevelopmentManufacturing Flow
Industry Keywords
Semiconductor PackagingAssembly IndustryMechanical EngineeringMaterials SciencePhysics

Tech Stack

Tools & technologies
Assembly

About the role

Key responsibilities & impact
  • Serve as a technical expert for advanced packaging technologies, 2.5D/3D
  • Work directly with key suppliers to develop and enable new processes
  • Engage with leading assembly suppliers to understand assembly process
  • Define assembly process integration and flow for advanced multiple die heterogeneous integration
  • Develop comprehensive plans of assembly and reliability
  • Resolve design challenges and implement working solutions using DfM/DfR principles

Requirements

What you’ll need
  • BS/MS/PhD in Mechanical Engineering, Materials Science, Physics or a closely related field
  • 5+ years of progressive experience in Semiconductor Packaging and Assembly Industry
  • Proven experience in advanced packaging technology development and execution
  • Comprehensive knowledge and understanding of advanced CoWoS package assembly and manufacturing flow
  • Previous experience with substrate manufacturing processes and design rules
  • Experience with package design physical attribute and material selection

Benefits

Comp & perks
  • Health insurance
  • Flexible working hours
  • Professional development opportunities